K61P256M120SF3 Datasheet, PDF (26/90 Pages) Freescale Semiconductor, Inc – K61 Sub-Family Data Sheet

Peripheral operating requirements and behaviors
5.4.2 Thermal attributes
Board type
Single-layer (1s)
Symbol
R_θJA
Four-layer (2s2p) R_θJA
Single-layer (1s) R_θJMA
Four-layer (2s2p) R_θJMA
—
R_θJB
—
R_θJC
—
Ψ_JT
Description
256 MAPBGA
Thermal
43
resistance, junction
to ambient (natural
convection)
Thermal
28
resistance, junction
to ambient (natural
convection)
Thermal
36
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
25
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
17
resistance, junction
to board
Thermal
8
resistance, junction
to case
Thermal
2
characterization
parameter, junction
to package top
outside center
(natural
convection)
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
1, 2
1,2, 3
1,3
1,3
4
5
6
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air) with the single layer board horizontal. Board meets JESD51-9 specification.
3.
Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental
Conditions—Forced Convection (Moving Air) with the board horizontal.
4.
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.
5.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
6.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
6 Peripheral operating requirements and behaviors
K61 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
26
Preliminary
Freescale Semiconductor, Inc.