K61P256M120SF3 Datasheet, PDF (25/90 Pages) Freescale Semiconductor, Inc – K61 Sub-Family Data Sheet

Symbol
t_io60
Table 10. General switching specifications (continued)
Description
Port rise and fall time (low drive strength)
• Slew disabled
• Slew enabled
Min.
Max.
Unit
—
TBD
ns
—
TBD
ns
t_tamper
Port rise and fall time (high drive strength)
• Slew disabled
• Slew enabled
—
TBD
ns
—
TBD
ns
t_tamper
Port rise and fall time (low drive strength)
• Slew disabled
• Slew enabled
—
TBD
ns
—
TBD
ns
t_ddr
Port rise time
• DDR1
• DDR2
• LPDDR
—
TBD
ns
—
TBD
ns
—
TBD
ns
t_ddr
Port fall time
• DDR1
• DDR2
• LPDDR
—
TBD
ns
—
TBD
ns
—
TBD
ns
1. The greater synchronous and asynchronous timing must be met.
2. This is the shortest pulse that is guaranteed to be recognized.
3. 25pF load
4. 15pF load
5. 75pF load
6. 15pF load
7. 75pF load
8. 15pF load
9. DDR —rise and fall times at 50 Ω transmission line impedance terminated to 0.5 × V_{DD_DDR} + 5 pF load.
10. Rising slew rate measured between 0.5 × V_{DD_DDR} and 0.5 × V_{DD_DDR} + 250 mV for all modes.
11. Falling slew rate measured between 0.5 × V_{DD_DDR} and 0.5 × V_{DD_DDR} – 250 mV for all modes.
General
Notes
3
4
5
6
7
8
9
10
11
9
10
11
5.4 Thermal specifications
5.4.1 Thermal operating requirements
Table 11. Thermal operating requirements
Symbol
T_J
T_A
Description
Die junction temperature
Ambient temperature
Min.
–40
–40
Max.
125
105
K61 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Freescale Semiconductor, Inc.
Preliminary
Unit
°C
°C
25