MC68711E20CFNE3 Datasheet, PDF (183/242 Pages) –

52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
11.6 52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
-A-
R
0.51 (0.020) M T A S B S
N -B-
0.51 (0.020) M T A S B S
F
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R AND N DO NOT INCLUDE
GLASS PROTRUSION. GLASS PROTRUSION
TO BE 0.25 (0.010) MAXIMUM.
4. ALL DIMENSIONS AND TOLERANCES
INCLUDE LEAD TRIM OFFSET AND LEAD
INCHES
DIM MIN MAX
A 0.785 0.795
B 0.785 0.795
C 0.165 0.200
D 0.017 0.021
F 0.026 0.032
G 0.050 BSC
H 0.090 0.130
J 0.006 0.010
K 0.035 0.045
N 0.735 0.756
R 0.735 0.756
S 0.690 0.730
MILLIMETERS
MIN MAX
19.94 20.19
19.94 20.19
4.20 5.08
0.44 0.53
0.67 0.81
1.27 BSC
2.29 3.30
0.16 0.25
0.89 1.14
18.67 19.20
18.67 19.20
17.53 18.54
C
G
J
S
H
0.15 (0.006)
-T- SEATING
PLANE
D 52 PL
0.18 (0.007) M T A S B S
M68HC11E Family Data Sheet, Rev. 5.1
Freescale Semiconductor
183