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MC9RS08KA2 Datasheet, PDF (118/132 Pages) Freescale Semiconductor, Inc – Microcontrollers | |||
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Appendix A Electrical Characteristics
Table A-9. FLASH Characteristics
Characteristic
Symbol
Min
Typical1
Max
Unit
Supply voltage for program/erase
VDD
2.7
â
5.5
V
Program/Erase voltage
VPP
11.8
12
12.2
V
VPP current
Program
Mass erase
IVPP_prog
â
IVPP_erase
â
â
200
µA
â
100
µA
Supply voltage for read operation
0 < fBus < 10 MHz
VRead
1.8
â
5.5
V
Byte program time
tprog
20
â
40
µs
Mass erase time
Cumulative program HV time2
tme
500
â
â
ms
thv
â
â
8
ms
Total cumulative HV time
(total of tme & thv applied to device)
thv_total
â
â
2
hours
HVEN to program setup time
tpgs
10
â
â
µs
PGM/MASS to HVEN setup time
tnvs
5
â
â
µs
HVEN hold time for PGM
tnvh
5
â
â
µs
HVEN hold time for MASS
tnvh1
100
â
â
µs
VPP to PGM/MASS setup time
tvps
20
â
â
ns
HVEN to VPP hold time
VPP rise time3
tvph
20
â
â
ns
tvrs
200
â
â
ns
Recovery time
trcv
1
â
â
µs
Program/erase endurance
TL to TH = â40°C to + 85°C
1000
â
â
cycles
Data retention
tD_ret
15
100
â
years
1 Typicals are measured at 25°C.
2 thv is the cumulative high voltage programming time to the same row before next erase. Same address can not
be programmed more than twice before next erase.
3 Fast VPP rise time may potentially trigger the ESD protection structure, which may result in over current ï¬owing
into the pad and cause permanent damage to the pad. External ï¬ltering for the VPP power source is
recommended. An example VPP ï¬lter is shown in Figure A-3.
MC9RS08KA2 Series Data Sheet, Rev. 2
118
Freescale Semiconductor
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