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MC9RS08KA2 Datasheet, PDF (118/132 Pages) Freescale Semiconductor, Inc – Microcontrollers
Appendix A Electrical Characteristics
Table A-9. FLASH Characteristics
Characteristic
Symbol
Min
Typical1
Max
Unit
Supply voltage for program/erase
VDD
2.7
—
5.5
V
Program/Erase voltage
VPP
11.8
12
12.2
V
VPP current
Program
Mass erase
IVPP_prog
—
IVPP_erase
—
—
200
µA
—
100
µA
Supply voltage for read operation
0 < fBus < 10 MHz
VRead
1.8
—
5.5
V
Byte program time
tprog
20
—
40
µs
Mass erase time
Cumulative program HV time2
tme
500
—
—
ms
thv
—
—
8
ms
Total cumulative HV time
(total of tme & thv applied to device)
thv_total
—
—
2
hours
HVEN to program setup time
tpgs
10
—
—
µs
PGM/MASS to HVEN setup time
tnvs
5
—
—
µs
HVEN hold time for PGM
tnvh
5
—
—
µs
HVEN hold time for MASS
tnvh1
100
—
—
µs
VPP to PGM/MASS setup time
tvps
20
—
—
ns
HVEN to VPP hold time
VPP rise time3
tvph
20
—
—
ns
tvrs
200
—
—
ns
Recovery time
trcv
1
—
—
µs
Program/erase endurance
TL to TH = –40°C to + 85°C
1000
—
—
cycles
Data retention
tD_ret
15
100
—
years
1 Typicals are measured at 25°C.
2 thv is the cumulative high voltage programming time to the same row before next erase. Same address can not
be programmed more than twice before next erase.
3 Fast VPP rise time may potentially trigger the ESD protection structure, which may result in over current flowing
into the pad and cause permanent damage to the pad. External filtering for the VPP power source is
recommended. An example VPP filter is shown in Figure A-3.
MC9RS08KA2 Series Data Sheet, Rev. 2
118
Freescale Semiconductor