XR16C850CM-F Datasheet, PDF (42/56 Pages) Exar Corporation – 2.97V TO 5.5V UART WITH 128-BYTE FIFO

XR16C850
2.97V TO 5.5V UART WITH 128-BYTE FIFO
ABSOLUTE MAXIMUM RATINGS
Power Supply Range
Voltage at Any Pin
Operating Temperature
Storage Temperature
Package Dissipation
xr
REV. 2.3.1
7 Volts
GND-0.3 V to 7 V
-40^o to +85^oC
-65^o to +150^oC
500 mW
TYPICAL PACKAGE THERMAL RESISTANCE DATA (MARGIN OF ERROR: ± 15%)
Thermal Resistance (48-TQFP)
theta-ja =59^oC/W, theta-jc = 16^oC/W
Thermal Resistance (44-PLCC)
theta-ja = 50^oC/W, theta-jc = 21^oC/W
ELECTRICAL CHARACTERISTICS
DC ELECTRICAL CHARACTERISTICS
UNLESS OTHERWISE NOTED: TA=0^O TO 70^OC (-40^O TO +85^OC FOR INDUSTRIAL GRADE PACKAGE), VCC = 2.97V TO
5.5V
SYMBOL
PARAMETER
V_ILCK
V_IHCK
V_IL
V_IH
V_IH
V_OL
V_OL
V_OH
V_OH
I_IL
I_IH
C_IN
I_CC
I_SLEEP
Clock Input Low Level
Clock Input High Level
Input Low Voltage
Input High Voltage
(top mark date code of "EC YYWW" and older)
Input High Voltage
(top mark date code of "F2 YYWW and newer)
Output Low Voltage
Output Low Voltage
Output High Voltage
Output High Voltage
Input Low Leakage Current
Input High Leakage Current
Input Pin Capacitance
Power Supply Current
Sleep Current
LIMITS
3.3V
MIN
MAX
-0.3 0.6
2.4 VCC
-0.3 0.8
2.0 VCC
2.0
5.5
0.4
2.0
±10
±10
5
2.7
30
LIMITS
5.0V
MIN
MAX
-0.5 0.6
3.0 VCC
-0.5 0.8
2.2 VCC
UNITS
V
V
V
V
CONDITIONS
2.2
5.5
V
0.4
V I_OL = 6 mA
V I_OL = 4 mA
2.4
V I_OH = -6 mA
V I_OH = -1 mA
±10 uA
±10 uA
5
pF
4
mA
50
uA See Test 1
Test 1: The following inputs should remain steady at VCC or GND state to minimize sleep current: A0-A2, D0-D7, IOR#,
IOW#, CS# and modem inputs. Also, RX input must idle at logic 1 state while in sleep mode. In mixed voltage environ-
ments, where the voltage at any of the inputs of the 651 is lower than its VCC supply voltage, the sleep current will be high-
er than the maximum values given here.
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