80-0206-R Datasheet, PDF (46/49 Pages) List of Unclassifed Manufacturers – Speech Recognition Processor

RSC-4128
Data Sheet
RSC-4128 Die Bonding Pad Locations
PAD #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
PADNAME X (um)
P0.0
95
D7
95
D6
95
PDN
95
D5
95
D4
95
GND
95
GND
95
XO1
95
XI1
95
VDD
95
VDD
95
-XM
95
XO2
95
XI2
95
D3
95
D2
95
P2.7
95
D1
95
D0
95
GND
95
GND
95
VDD
95
VDD
95
P2.6
95
reserved 95
P2.5
95
reserved 95
-RESET 95
Y (um)
4564
4412
4260
4107
3955
3803
3651
3498
3346
3251
3063
2858
2729
2605
2510
2376
2238
2095
1943
1790
1667
1434
1282
1129
964
825
672
520
368
PAD #
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
PADNAME X (um)
DACOUT 447
AVSS
542
VCM
637
MICIN2 732
MICIN1 827
AMPCOM 922
VREF 1017
AVDD 1112
P2.4
1364
P2.3
1459
P2.2
1554
GND
1649
P2.1
1744
P2.0
1839
GND
1934
VDD
2029
-RDF
2124
-WRD 2219
-RDR 2314
-WRC 2409
A19
2504
A18
2599
reserved 2694
Y (um)
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
95
PAD #
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
PADNAME X (um) Y (um)
PLLEN 2965 368
A17
2965 516
P1.7
2965 665
A16
2965 813
P1.6
2965 961
GND
2965 1110
GND
2965 1291
VDD
2965 1446
VDD
2965 1681
A15
2965 1831
P1.5
2965 1972
A14
2965 2104
P1.4
2965 2237
A13
2965 2366
P1.3
2965 2481
A12
2965 2596
P1.2
2965 2708
A11
2965 2817
P1.1
2965 3061
A10
2965 3194
GND
2965 3358
GND
2965 3513
VDD
2965 3678
VDD
2965 3827
A9
2965 3975
P1.0
2965 4123
A8
2965 4272
A7
2965 4420
P0.7
2965 4568
PAD #
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
PADNAME X (um) Y (um)
P0.6
2694 4880
A6
2599 4880
P0.5
2504 4880
A5
2409 4880
P0.4
2314 4880
A4
2219 4880
GND
2124 4880
GND
2029 4880
PWM0 1792 4880
PWM1 1366 4880
VDD
1128 4880
VDD
1033 4880
A3
938 4880
P0.3
843 4880
A2
748 4880
P0.2
653 4880
A1
558 4880
P0.1
463 4880
A0
368 4880
Notes:
1. Coordinates are in microns (um), rounded to nearest um.
2. Coordinates are of the center of the bonding pad opening (70um).
3. Coordinate (0,0) is the lower left corner of the die.
4. Die size with scribe and seal ring is 3060 um x 4975 um.
5. No external die substrate tie is required. However, a substrate tie to ground is preferred.
46
P/N 80-0206-R
© 2006 Sensory Inc.