LUPA-4000 Datasheet, PDF (45/49 Pages) Cypress Semiconductor – 4M Pixel CMOS Image Sensor

LUPA-4000
Data Sheet
7 Handling and soldering precautions
Special care should be given when soldering image sensors with color filter arrays
(RGB color filters), onto a circuit board, since color filters are sensitive to high
temperatures. Prolonged heating at elevated temperatures may result in deterioration
of the performance of the sensor. The following recommendations are made to ensure
that sensor performance is not compromised during end-users’ assembly processes.
Board Assembly:
Device placement onto boards should be done in accordance with strict ESD controls
for Class 0, JESD22 Human Body Model, and Class A, JESD22 Machine Model
devices. Assembly operators should always wear all designated and approved
grounding equipment; grounded wrist straps at ESD protected workstations are
recommended including the use of ionized blowers. All tools should be ESD
protected.
Manual Soldering:
When a soldering iron is used the following conditions should be observed:
Use a soldering iron with temperature control at the tip.
The soldering iron tip temperature should not exceed 350°C.
The soldering period for each pin should be less than 5 seconds.
Precautions and cleaning:
Avoid spilling solder flux on the cover glass; bare glass and particularly glass with
antireflection filters may be adversely affected by the flux. Avoid mechanical or
particulate damage to the cover glass.
It is recommended that isopropyl alcohol (IPA) is used as a solvent for cleaning the
image sensor glass lid. When using other solvents, it should be confirmed beforehand
whether the solvent will dissolve the package and/or the glass lid or not.
Cypress Semiconductor Corporation
3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: [e-mail] Document #: 38-05712 Rev.**(Revision 1.2 )
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