LUPA-4000 Datasheet, PDF (44/49 Pages) Cypress Semiconductor – 4M Pixel CMOS Image Sensor

LUPA-4000
Data Sheet
6.4 Bonding diagram
The die is bonded to the bonding pads of the package as indicated below.
Figure 25: Bonding pads diagram of the LUPA-4000 package
The die will be placed in the package in a way that the center of the light sensitive
area will match the center of the package.
Cypress Semiconductor Corporation
3901 North First Street
San Jose, CA 95134
408-943-2600
Contact: [e-mail] Document #: 38-05712 Rev.**(Revision 1.2 )
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