AM188ES-40KCW Datasheet, PDF (55/102 Pages) Advanced Micro Devices – High Performance, 80C186-/80C188-Compatible and 80L186-/80L188-Compatible, 16-Bit Embedded Microcontrollers

PRELIMINARY
THERMAL CHARACTERISTICS
TQFP Package
The Am186ES and Am188ES microcontrollers are
specified for operation with case temperature ranges
from 0°C to +100°C for a commercial device. Case
temperature is measured at the top center of the
package as shown in Figure 13. The various
temperatures and thermal resistances can be
determined using the equations in Figure 14 with
information given in Table 10.
θ_JA is the total thermal resistance. θ_JA is the sum of θ_JC,
the internal thermal resistance of the assembly, and
θ_CA, the case to ambient thermal resistance.
The variable P is power in watts. Typical power supply
current (I_CC) is TBD mA per MHz of clock frequency.
θ_JA
θ_CA
T_{C θJC}
θ_JA = θ_JC + θ_CA
Figure 13. Thermal Resistance(°C/Watt)
θ_PJ=AIC=_Cθ_{⋅JCfre+q}θ_{(CMAHz) ⋅ VCC}
T_J
T_J
=
=
T_C +(
T_A+ (
PP⋅⋅θθ_JJCA))
T_C
T_C
=
=
T_J – (
T_A +(
PP⋅⋅θθ_JCCA))
T_A
T_A
=
=
T_J – (
T_C – (
PP⋅⋅θθ_JCAA))
Figure 14. Thermal Characteristics Equations
Table 10. Thermal Characteristics (°C/Watt)
Airflow
(Linear Feet
Package/Board per Minute)
θ_JA
θ_JC
θ_CA
PQFP/2-Layer
0 fpm
45
7
38
200 fpm
39
7
32
400 fpm
35
7
28
TQFP/2-Layer
600 fpm
0 fpm
200 fpm
400 fpm
33
7
26
56
10
46
46
10
36
40
10
30
PQFP/4-Layer
to 6-Layer
TQFP/4-Layer
to 6-Layer
600 fpm
0 fpm
200 fpm
400 fpm
600 fpm
0 fpm
200 fpm
400 fpm
600 fpm
38
10
28
23
5
18
21
5
16
19
5
14
17
5
12
30
6
24
28
6
22
26
6
20
24
6
18
Am186/188ES and Am186/188ESLV Microcontrollers
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