PALCE29M16H-25 Datasheet, PDF (22/22 Pages) Advanced Micro Devices – 24-Pin EE CMOS Programmable Array Logic

AMD
TYPICAL THERMAL CHARACTERISTICS
Measured at 25°C ambient. These parameters are not tested.
Parameter
Symbol Parameter Description
Typ
SKINNYDIP PLCC
Unit
θjc
Thermal Impedance, Junction to Case
17
θja
Thermal Impedance, Junction to Ambient
63
θjma
Thermal Impedance, Junction to Ambient with Air Flow 200 Ifpm air
60
400 Ifpm air
52
600 Ifpm air
43
800 Ifpm air
39
11
°C/W
51
°C/W
43
°C/W
38
°C/W
34
°C/W
30
°C/W
Plastic θjc Considerations
The data listed for plastic θjc are for reference only and are not recommended for use in calculating junction temperatures. The
heat-flow paths in plastic-encapsulated devices are complex, making the θjc measurement relative to a specific location on the
package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the
package. Furthermore, θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a
constant temperature. Therefore, the measurements can only be used in a similar environment.
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