GC5316_14 Datasheet, PDF (70/76 Pages) Texas Instruments – HIGH-DENSITY DIGITAL DOWNCONVERTER AND UPCONVERTER

GC5316
SLWS154A − JANUARY 2004 − REVISED MARCH 2004
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
PARAMETER
Pad ring supply voltage
Core supply voltage
Input voltage (undershoot and overshoot)
Clamp current for an input or output
Storage temperature
Junction temperature
Lead soldering temperature (10 seconds)
ESD classification
Moisture sensitivity
Reflow conditions
SYMBOL
MIN
MAX
UNITS
VPAD
VCORE
VIN
−0.3
4
V
−0.3
1.8
V
−0.5
VPAD+0.5
V
−20
20
mA
Tstg
−65
140
_C
TJ
105
_C
300
_C
Class 2 (Passed 2.5-kV HBM, 500-V CDM, 150-V MM)
Class 4 (4 days floor life at 30°C/60%H)
JEDEC standard, 240°C max
CAUTION:Exceeding the absolute maximum ratings (min or max) may cause permanent damage to the part. These
are stress only ratings and are not intended for operation.
7.2 Recommended Operating Conditions
PARAMETER
MIN
MAX
UNITS
Pad ring supply voltage, VPAD
3
3.6
V
Core supply voltage, VCORE
1.5
1.65
V
Supply voltage difference VPAD – VCORE
2
V
Temperature ambient, no air flow(1), TA
−40
85
°C
Junction temperature(2), TJ
105
°C
(1) _{Chips specifications in Tables 6.4 and 6.5 are production tested to100°C case temperature. QA tests are performed at 85°C.}
(2) _{Thermal management will be required for full rate operation, see the following table and Section 7.4. The circuit is designed for junction temperatures}
up to 125°C. Sustained operation at elevated temperatures reduces long-term reliability. Lifetime calculations based on maximum junction temperature
of 105°C.
7.3 Thermal Characteristics
THERMAL CONDUCTIVITY
Theta junction-to-ambient (still air), θ_JA
Theta junction-to-ambient (2m/s estimated), θ_JA2m
Theta junction-to-case, θ_JC
(3) _{Air flow reduces θJA and is highly recommended.}
388 BGA
3W
13.5
9.3
2.4
UNITS
°C/W
°C/W
°C/W
70