BQ25120_16 Datasheet, PDF (7/68 Pages) Texas Instruments – Highly Integrated Battery Charge Management Solution

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BQ25120, BQ25121
SLUSBZ9B – AUGUST 2015 – REVISED MAY 2016
8.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq25120
YFP (DSBGA)
UNIT
25 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
60
0.3
12.0
°C/W
1.2
12.0
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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