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BQ25120_16 Datasheet, PDF (25/68 Pages) Texas Instruments – Highly Integrated Battery Charge Management Solution
www.ti.com
BQ25120, BQ25121
SLUSBZ9B – AUGUST 2015 – REVISED MAY 2016
9.3.17 Thermal Protection
During the charging process, to prevent overheating in the device, the juntion temperature of the die, TJ, is
monitored. When TJ reaches T(SHUTDOWN) the device stops charging, disables the PMID output, SYS output, and
disables the LS/LDO output. During the time that T(SHUTDOWN) is exceeded, the safety timer is reset and the
watchdog timer continues to operate if in host mode. The charge cycle resumes when TJ falls below T(SHUTDOWN)
by T(HYS).
To avoid reaching thremal shutdown, ensure that the system power dissipation is under the limits of the device.
The power dissipated by the device can be calculated using Equation 5.
PDISS = P(LS/LDO) + P(SYS) + P(LS/LDO) + P(BAT)
(5)
Where
• P(LS/LDO) = (VIN – V(LS/LDO)) x IIN
• P(LS/LDO) = (VIN – V(LS/LDO)) x IIN
• P(LS/LDO) = (V(INLS) – V(LS/LDO)) x I(LS/LDO)
• P(BAT) = (V(PMID) – V(BAT)) x I(BAT)
9.3.18 Typical Application Power Dissipation
The die junction temperature, TJ, can be estimated based on the expected board performance using Equation 6.
TJ = TA + θJA x PDISS
(6)
The θJA is largely driven by the board layout. For more information about traditional and new thermal metrics, see
the IC Package Thermal Metrics application report SPRA953. Under typical conditions, the time spent in this
state is short.
9.3.19 Status Indicators (PG and INT)
The device contains two open-drain outputs that signal its status and are valid only after the device has
completed start-up into a valid state. If the part starts into a fault, interrupts will not be sent. The PG output
signals when a valid input source is connected. PG pulls to GND when VIN is above VUVLO. PG is high-
impedance when the input power is not within specified limits. Connect PG to the desired logic voltage rail using
a 1-kΩ to 100-kΩ resistor, or use with an LED for visual indication.
The PG pin can be configured as a MR shifted (MRS) output when the PGB_MRS bit is set to 1. PG is high-
impedance when the MR input is not low, and PG pulls to GND when the MR input is below VOL(TH_MRS). Connect
PG to the desired logic voltage rail using a 1-kΩ to 100-kΩ resistor.
When enabled through OTP, the PG pin also functions as an OVP/UVP indicator. When the device is below VSLP
or VIN(DPM) (if enabled), a single 128us pulse is sent on PG to notify the host, repeating once per minute. When
the device has an input voltage greater than V(BAT) +1 V and VIN is less than VOVP, two consecutive 128us pulses
are sent on PG, to notify the host, repeating once per minute. The PG pin does not function as an input power
good indicator in this mode.
The INT pin is pulled low during charging when the EN_INT bit is set to 1. When EN_INT is set to 0, charging
status is not indicated on the INT pin. When charge is complete or disabled, INT is high impedance. The charge
status is valid whether it is the first charge or recharge. When a fault occurs, a 128 µs pulse (interrupt) is sent on
INT to notify the host.
9.3.20 Chip Disable (CD)
The device contains a CD input that is used to disable the device and place it into a high impedance mode when
only battery is present. In this case, when CD is low, PMID and SYS remain active, and the battery discharge
FET is turned on. If the LS/LDO output has been enabled prior to pulling CD low, it will stay on. The LSCTRL pin
can also enable/disable the LS/LDO output when the CD pin is pulled low. The CD pin has an internal pull-down.
If VIN is present and the CD input is pulled low, charge is enabled and all other functions remain active. If VIN is
present and the CD input is pulled high, charge is disabled.
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Product Folder Links: BQ25120 BQ25121
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