THS789 Datasheet, PDF (5/34 Pages) Texas Instruments – THS789 Quad-Channel Time Measurement Unit (TMU)

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THS789
SLOS776A – SEPTEMBER 2012 – REVISED DECEMBER 2015
6 Specifications
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted)
MIN
V_CC
Analog I/O to GND⁽¹⁾
4
–0.3
Digital I/O to GND
T_J Maximum junction temperature⁽²⁾
T_stg Storage temperature
–0.3
(1) LVDS outputs are not short-circuit-proof to GND.
(2) The THS789 device has an automatic power shutdown at 140°C, typical.
MAX
V_CC + 0.3
V_CC + 0.3
150
150
UNIT
V
V
V
°C
°C
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins ⁽²⁾
VALUE
±2000
±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating junction temperature range (unless otherwise noted)
V_CC
Supply voltage
T_J
Junction temperature
MCLOCK frequency
MIN
3.135
0
NOM
200
MAX
3.465
105
UNIT
V
°C
MHz
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
THS789
PFD (HTQFP)
UNIT
100 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
24.2
°C/W
10.4
°C/W
9.8
°C/W
0.3
°C/W
9.7
°C/W
0.5
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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