DRV2605L Datasheet, PDF (5/69 Pages) Texas Instruments – DRV2605L 2 to 5.2 V Haptic Driver for LRA and ERM With Effect Library and Smart-Loop Architecture

www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range, T_A = 25°C (unless otherwise noted)
V_DD
EN
Input voltage
SDA
SCL
IN/TRIG
Operating free-air temperature range, T_A
Operating junction temperature range, T_J
DRV2605L
SLOS854C – MAY 2014 – REVISED SEPTEMBER 2014
MIN
MAX
UNIT
–0.3
5.5
V
–0.3
–0.3
–0.3
–0.3
–40
V_DD + 0.3
V
V_DD + 0.3
V
V_DD + 0.3
V
V_DD + 0.3
V
85
°C
–40
150
°C
6.2 Handling Ratings
T_stg
V_(ESD)
Storage temperature range
Electrostatic
discharge
Human body model (HBM), per
ANSI/ESDA/JEDEC JS-001
DSBGA package, all pins
VSSOP package
OUT+, OUT–
Other pins
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins
MIN
–65
–1000
–500
–1000
–250
MAX
150
1000
500
1000
250
UNIT
°C
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_DD
ƒ_(PWM)
Z_L
V_IL
V_IH
V_I(ANA)
ƒ_(LRA)
Supply voltage
PWM input frequency
Load impedance
Digital low-level input voltage
Digital high-level input voltage
Input voltage (analog mode)
LRA Frequency Range
V_DD
IN/TRIG Pin
V_DD = 5.2 V
EN, IN/TRIG, SDA, SCL
EN, IN/TRIG, SDA, SCL
IN/TRIG
MIN
MAX UNIT
2
5.2 V
10
250 kHz
8
Ω
0.5 V
1.3
V
0
1.8 V
125
300 Hz
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DSBGA
(9-PINS)
UNIT
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
145.2
0.9
105
5.1
103.3
—
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: DRV2605L
Submit Documentation Feedback
5