LMH2190 Datasheet, PDF (3/32 Pages) National Semiconductor (TI) – Quad Channel 27 MHz Clock Tree Driver with I2C Interface

LMH2190
www.ti.com
SNAS473H – JUNE 2009 – REVISED MAY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS ⁽¹⁾⁽²⁾
Supply Voltage
V_BAT - V_SS
LVCMOS port IO voltage
Current on CLKx pins
ESD Tolerance ⁽³⁾
Human Body Model
Machine Model
Storage Temperature Range
Junction Temperature ⁽⁴⁾
Maximum Lead Temperature
(Soldering,10 sec)
-0.3V to 6V
-0.3V to (V_OUT + 0.3V)
+/- 65 mA
2000V
200V
−65°C to 150°C
150°C
230°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but performance is not specified. For specifications and the test conditions, see the
Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model, applicable std. MIL-STD-883, Method 3015.7. Machine model, applicable std. JESD22–A115–A (ESD MM std of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22–C101–C. (ESD FICDM std. of JEDEC)
(4) The maximum power dissipation is a function of T_J(MAX) , θ_JA and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) - T_A)/θ_JA. All numbers apply for packages soldered directly onto a PC board.
OPERATING RATINGS ⁽¹⁾
Supply Voltage (V_BAT - V_SS)
V_ENABLE
Input Clock, SCLK_IN
2.5V to 5.5V
0 to 2V
DC Mode
32 kHz to 27 MHz
AC Mode
13 MHz to 27 MHz
Duty Cycle
45% to 55%
Temperature Range
Package Thermal Resistance θ_JA(2)
-40°C to +85°C
113.6°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but performance is not specified. For specifications and the test conditions, see the
Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T_J(MAX) , θ_JA and T_A. The maximum allowable power dissipation at any ambient
temperature is P_D = (T_J(MAX) - T_A)/θ_JA. All numbers apply for packages soldered directly onto a PC board.
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