DS100MB201_16 Datasheet, PDF (17/26 Pages) Texas Instruments – Dual Lane 2:1/1:2 Mux/Buffer with Equalization

DS100MB201
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APPLICATIONS INFORMATION
SNLS333A – APRIL 2011 – REVISED APRIL 2013
GENERAL RECOMMENDATIONS
The DS100MB201 is a high performance circuit capable of delivering excellent performance. Careful attention
must be paid to the details associated with high-speed design as well as providing a clean power supply. Refer
to the LVDS Owner's Manual for more detailed information on high speed design tips to address signal integrity
design issues.
PCB LAYOUT CONSIDERATIONS FOR DIFFERENTIAL PAIRS
The CML inputs and CML compatible outputs must have a controlled differential impedance of 100Ω. It is
preferable to route differential lines exclusively on one layer of the board, particularly for the input traces. The
use of vias should be avoided if possible. If vias must be used, they should be used sparingly and must be
placed symmetrically for each side of a given differential pair. Route the differential signals away from other
signals and noise sources on the printed circuit board. See AN-1187 (SNOA401) for additional information on
WQFN packages.
POWER SUPPLY BYPASSING
Two approaches are recommended to ensure that the DS100MB201 is provided with an adequate power supply.
First, the supply (VDD) and ground (GND) pins should be connected to power planes routed on adjacent layers
of the printed circuit board. The layer thickness of the dielectric should be minimized so that the V_DD and GND
planes create a low inductance supply with distributed capacitance. Second, careful attention to supply
bypassing through the proper use of bypass capacitors is required. A 0.01 μF bypass capacitor should be
connected to each V_DD pin such that the capacitor is placed as close as possible to the DS100MB201. Smaller
body size capacitors can help facilitate proper component placement. Additionally, three capacitors with
capacitance in the range of 2.2 μF to 10 μF should be incorporated in the power supply bypassing design as
well. These capacitors can be either tantalum or an ultra-low ESR ceramic.
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