TLK2711-SP_15 Datasheet, PDF (1/29 Pages) Texas Instruments – 1.6-Gbps to 2.5-Gbps Class V Transceiver

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TLK2711-SP
SGLS307N – JULY 2006 – REVISED DECEMBER 2015
TLK2711-SP 1.6-Gbps to 2.5-Gbps Class V Transceiver
1 Features
•1 1.6- to 2.5-Gbps (Gigabits Per Second)
Serializer/Deserializer
• Hot-Plug Protection
• High-Performance 68-Pin Ceramic Quad Flat
Pack Package (HFG)
• Low-Power Operation
• Programmable Preemphasis Levels on Serial
Output
• Interfaces to Backplane, Copper Cables, or
Optical Converters
• On-Chip 8-Bit/10-Bit Encoding/Decoding, Comma
Detect
• On-Chip PLL Provides Clock Synthesis From
Low-Speed Reference
• Low Power: <500 mW
• 3-V Tolerance on Parallel Data Input Signals
• 16-Bit Parallel TTL-Compatible Data Interface
• Ideal for High-Speed Backplane Interconnect and
Point-to-Point Data Link
• Military Temperature Range (–55°C to 125°C
T_case)
• Loss of Signal (LOS) Detection
• Integrated 50-Ω Termination Resistors on RX
• Engineering Evaluation (/EM) Samples are
Available ⁽¹⁾
2 Applications
• Point-to-Point High Speed I/O
• Data Acquisition
• Data Processing
(1) These units are intended for engineering evaluation only.
They are processed to a non-compliant flow (for example, no
burn-in, and so forth) and are tested to temperature rating of
25°C only. These units are not suitable for qualification,
production, radiation testing, or flight use. Parts are not
warranted for performance on full MIL specified temperature
range of –55°C to 125°C or operating life.
3 Description
The TLK2711-SP is a member of the WizardLink
transceiver family of multigigabit transceivers,
intended for use in ultra-high-speed bidirectional
point-to-point data transmission systems. The
TLK2711-SP supports an effective serial interface
speed of 1.6 Gbps to 2.5 Gbps, providing up to
2 Gbps of data bandwidth.
The primary application of the TLK2711-SP is to
provide high-speed I/O data channels for point-to-
point baseband data transmission over controlled
impedance media of approximately 50 Ω. The
transmission media can be printed circuit board,
copper cables, or fiber-optic cable. The maximum
rate and distance of data transfer is dependent upon
the attenuation characteristics of the media and the
noise coupling to the environment.
PART NUMBER
TLK2711-SP
Device Information⁽¹⁾
PACKAGE
BODY SIZE (NOM)
CFP (68)
13.97 mm × 13.97 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
External Component Interconnection
1 nF−10 nF^†
VDD _{Recommended use of 0.01-µF}
capacitor per VDD terminal
5 Ω at 100 MHz
1 nF−10 nF^†
1 nF−10 nF^†
0.01 µF
0.01 µF
1 nF−10 nF^†
0.01 µF 0.01 µF 0.01 µF
VDD
TXD3
TXD4
TXD5
GND
TXD6
TXD7
GTX_CLK
VDD
TXD8
TXD9
TXD10
GND
TXD11
TXD12
TXD13
GND
68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52
1
51
2
50
3
49
4
48
5
47
6
46
7
45
8
44
9
43
10
42
11
41
12
40
13
39
14
38
15
37
16
36
17
35
18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34
GND
VDD
RXD3
RXD4
RXD5
RXD6
GND
RXD7
RX_CLK
RXD8
RXD9
VDD
RXD10
RXD11
RXD12
RXD13
GND
† _{For ac coupling}
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.