OMAPL137DZKB3 Datasheet, PDF (5/223 Pages) Texas Instruments – OMAP-L137 Low-Power Applications Processor

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1 OMAP-L137 Low-Power Applications Processor . 1
1.1 Features ............................................. 1
1.2 Description ........................................... 3
1.3 Functional Block Diagram ........................... 4
Revision History .............................................. 6
2 Device Overview ........................................ 9
2.1 Device Characteristics ............................... 9
2.2 Device Compatibility ................................ 10
2.3 ARM Subsystem .................................... 10
2.4 DSP Subsystem .................................... 13
2.5 Memory Map Summary ............................ 24
2.6 Pin Assignments .................................... 27
2.7 Terminal Functions ................................. 28
3 Device Configuration ................................. 49
3.1 Boot Modes ......................................... 49
3.2 SYSCFG Module ................................... 50
3.3 Pullup/Pulldown Resistors .......................... 52
4 Device Operating Conditions ....................... 53
4.1 Absolute Maximum Ratings Over Operating Case
Temperature Range
(Unless Otherwise Noted) ................................. 53
4.2 Recommended Operating Conditions .............. 54
4.3 Notes on Recommended Power-On Hours (POH) . 55
4.4 Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating Case
Temperature (Unless Otherwise Noted) ........... 56
5 Peripheral Information and Electrical
Specifications .......................................... 57
5.1 Parameter Information .............................. 57
5.2 Recommended Clock and Control Signal Transition
Behavior ............................................ 58
5.3 Power Supplies ..................................... 58
5.4 Unused USB0 (USB2.0) and USB1 (USB1.1) Pin
Configurations ...................................... 59
5.5 Reset ............................................... 60
5.6 Crystal Oscillator or External Clock Input .......... 63
5.7 Clock PLLs ......................................... 65
5.8 Interrupts ............................................ 69
OMAP-L137
SPRS563F – SEPTEMBER 2008 – REVISED FEBRUARY 2013
5.9 General-Purpose Input/Output (GPIO) ............. 78
5.10 EDMA ............................................... 81
5.11 External Memory Interface A (EMIFA) ............. 86
5.12 External Memory Interface B (EMIFB) ............. 97
5.13 Memory Protection Units .......................... 104
5.14 MMC / SD / SDIO (MMCSD) ...................... 107
5.15 Ethernet Media Access Controller (EMAC) ....... 110
5.16 Management Data Input/Output (MDIO) .......... 115
5.17 Multichannel Audio Serial Ports (McASP0, McASP1,
and McASP2) ..................................... 117
5.18 Serial Peripheral Interface Ports (SPI0, SPI1) .... 130
5.19 Enhanced Capture (eCAP) Peripheral ............ 149
5.20 Enhanced Quadrature Encoder (eQEP) Peripheral
..................................................... 152
5.21 Enhanced High-Resolution Pulse-Width Modulator
(eHRPWM) ........................................ 154
5.22 LCD Controller .................................... 158
5.23 Timers ............................................. 173
5.24 Inter-Integrated Circuit Serial Ports (I2C0, I2C1) . 175
5.25 Universal Asynchronous Receiver/Transmitter
(UART) ............................................ 180
5.26 USB1 Host Controller Registers (USB1.1 OHCI) . 182
5.27 USB0 OTG (USB2.0 OTG) ........................ 183
5.28 Host-Port Interface (UHPI) ........................ 191
5.29 Power and Sleep Controller (PSC) ................ 198
5.30 Programmable Real-Time Unit Subsystem (PRUSS)
..................................................... 201
5.31 Emulation Logic ................................... 204
5.32 IEEE 1149.1 JTAG ................................ 211
5.33 Real Time Clock (RTC) ........................... 213
6 Device and Documentation Support ............. 216
6.1 Device Support .................................... 216
6.2 Documentation Support ........................... 217
6.3 Community Resources ............................ 218
7 Mechanical Packaging and Orderable
Information ............................................ 219
7.1 Thermal Data for ZKB ............................. 219
7.2 Packaging Information ............................ 219
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