OMAPL137DZKB3 Datasheet, PDF (219/223 Pages) Texas Instruments – OMAP-L137 Low-Power Applications Processor

OMAP-L137
www.ti.com
SPRS563F – SEPTEMBER 2008 – REVISED FEBRUARY 2013
7 Mechanical Packaging and Orderable Information
This section describes the OMAP-L137 orderable part numbers, packaging options, materials, thermal and
mechanical parameters.
This section contains mechanical drawings for the ZKB Plastic Ball Grid Array package .
7.1 Thermal Data for ZKB
The following table(s) show the thermal resistance characteristics for the PBGA–ZKB mechanical
package.
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZKB]
No.
1 RΘ_JC
2 RΘ_JB
3 RΘ_JA
4
5
6
RΘ_JMA
7
8
9
10 Psi_JT
11
12
13
14
15 Psi_JB
16
17
Junction-to-case
Junction-to-board
Junction-to-free air
Junction-to-moving air
Junction-to-package top
Junction-to-board
°C/W ⁽¹⁾
12.8
15.1
24.5
21.9
21.1
20.4
19.6
0.6
0.8
0.9
1.1
1.3
14.9
14.4
14.4
14.3
14.1
°C/W ⁽²⁾
13.5
19.7
33.8
30
28.7
27.4
26
0.8
1
1.2
1.4
1.8
19.1
18.2
18
17.7
17.4
AIR FLOW
(m/s) ⁽³⁾
N/A
N/A
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and
1.5oz (50um) inner copper thickness
(2) Simulation data, using the same model but with 1oz (35um) top and bottom copper thickness and 0.5oz (18um) inner copper thickness.
Power dissipation of 1W and ambient temp of 70C assumed.
(3) m/s = meters per second
7.2 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
Copyright © 2008–2013, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information 219
Submit Documentation Feedback
Product Folder Links: OMAP-L137