TDC1011_15 Datasheet, PDF (4/49 Pages) Texas Instruments – TDC1011 Single Channel Ultrasonic Sensing Analog Front End (AFE) for Level Sensing,Concentration Sensing Applications

TDC1011
SNAS662 – JULY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) ⁽¹⁾⁽²⁾
V_DD
Analog supply voltage, VDD pins
V_IO
I/O supply voltage (V_IO must always be lower than or equal to V_DD supply)
V_I
Voltage on any analog input pin⁽³⁾
V_I
Voltage on any digital input pin⁽³⁾
I_I
Input current at any pin
T_J
Operating junction temperature
T_stg
Storage temperature range
MIN
MAX
UNIT
–0.3
6.0
V
–0.3
6.0
V
–0.3
–0.3
V_DD + 0.3
V
V_IO + 0.3
V
5
mA
–40
125
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) When the input voltage at a pin exceeds the power supplies, the current at that pin must not exceed 5 mA and the voltage (V_I) at that
pin must not exceed 6.0 V.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per AEC A100-002⁽¹⁾
Charged-device model (CDM), per AEC
Q100-011
All pins
Corner pins (1, 14, 15
and 28)
VALUE
±2000
±500
±750
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
V_DD
V_IO
V_I
V_I
ƒ_CLKIN
T_J
Analog supply voltage, VDD pins
Digital supply voltage, (V_IO must always be lower than or equal to V_DD supply)
Voltage on any analog input pin
Voltage on any digital input pin
Operating frequency
Operating junction temperature
MIN
2.7
1.8
GND
GND
0.06
–40
MAX
5.5
V_DD
V_DD
V_IO
16
125
UNIT
V
V
V
V
MHz
°C
6.4 Thermal Information⁽¹⁾
THERMAL METRIC
TDC1011
TSSOP
PW (28 PINS)
UNIT
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
83.5
29.9
40.8
°C/W
2.4
40.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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