LSM320HAY30 Datasheet, PDF (39/42 Pages) STMicroelectronics – MEMS motion sensor module: 3D digital accelerometer and 2D pitch and yaw analog gyroscope

LSM320HAY30
9
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 11. LGA-28: mechanical data and package dimensions
Dim.
A1
A2
A3
D1
E1
N1
L1
L2
P2
T1
T2
M
d
k
h
Min.
4.25
7.25
mm
Typ.
0.855
0.2
4.4
7.5
0.3
5.4
1.8
1.2
0.6
0.4
0.1
0.3
0.05
0.1
Max.
1.1
4.55
7.55
Outline and
mechanical data
LGA-28L (4.4x7.5x1.1mm)
Land Grid Array Package
E1
k
A
E
B
TOP VIEW
Pin 1 Indicator
k
C
D
hC
A3
kE
kD
A2
A1
Seating
Plane
K
Doc ID 16917 Rev 1
= _L1 =
N1
T1
T2
8190050A
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