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| LSM320HAY30 Datasheet, PDF (19/42 Pages) STMicroelectronics – MEMS motion sensor module: 3D digital accelerometer and 2D pitch and yaw analog gyroscope | |||
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LSM320HAY30
Application hints
5.3
Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and âGreenâ standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave âpin 1 Indicatorâ unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com.
Doc ID 16917 Rev 1
19/42
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