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| LSM330DL Datasheet, PDF (20/54 Pages) STMicroelectronics – Linear sensor module 3D accelerometer sensor and 3D gyroscope sensor | |||
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Application hints
LSM330DL
The functions, the threshold and the timing of the two interrupt pins for each sensor can be
completely programmed by the user though the SPI/I2C interface.
4.2
Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and âGreenâ standards.
It is qualified for soldering heat resistance according to JEDEC J-STD-020D.
Leave âPin 1 Indicatorâ unconnected during soldering.
The landing pattern and soldering recommendations are available at www.st.com/mems.
20/54
Doc ID 022018 Rev 1
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