LSM330DL Datasheet, PDF (1/54 Pages) STMicroelectronics – Linear sensor module 3D accelerometer sensor and 3D gyroscope sensor

LSM330DL
Linear sensor module
3D accelerometer sensor and 3D gyroscope sensor
Preliminary data
Features
■ Analog supply voltage 2.4 V to 3.6 V
■ Digital supply voltage I/Os, 1.8V
■ Low-power mode
■ Power-down mode
■ 3 independent acceleration channels and 3
angular rate channels
■ ±2g/±4g/±8g/±16g dynamic, selectable full-
scale acceleration range
■ ±250/±500/±2000 dps dynamic, selectable full-
scale angular rate
■ SPI/I²C serial interface (16-bit data output)
■ Programmable interrupt generator for free-fall
and motion detection
■ ECOPACK^®, RoHS, and “Green” compliant
Applications
■ GPS navigation systems
■ Impact recognition and logging
■ Gaming and virtual reality input devices
■ Motion-activated functions
■ Intelligent power saving for handheld devices
■ Vibration monitoring and compensation
■ Free-fall detection
■ 6D-orientation detection
Description
The LSM330DL is a system-in-package featuring
a 3D digital accelerometer and a 3D digital
gyroscope.
Table 1. Device summary
Part number
Temperature range [°C]
LSM330DL
LSM330DLTR
-40 to +85
-40 to +85
LLGA 28L 7.5 x 4.4 x 1.1 mm
ST’s family of modules leverages a robust and
mature manufacturing process already used for
the production of micromachined accelerometers.
The various sensing elements are manufactured
using specialized micromachining processes,
while the IC interfaces are based on CMOS
technology that allows designing a dedicated
circuit which is trimmed to better match the
sensing element characteristics.
The LSM330DL has a dynamic, user-selectable
full-scale acceleration range of ±2g/±4g/±8g/±16g
and an angular rate of ±250/±500/±2000 deg/sec.
The accelerometer and gyroscope sensors can
be either activated or put in low-power / power-
down mode separately for power-saving
optimized applications. The LSM330DL is
available in a plastic land grid array (LGA)
package.
Several years ago ST successfully pioneered the
use of this package for accelerometers. Today, ST
has the broadest manufacturing capability in the
world and unrivalled expertise for the production
of sensors in a plastic LGA package.
Package
LGA-28
LGA-28
Packing
Tray
Tape & reel
July 2011
Doc ID 022018 Rev 1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
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