LSM6DS3US Datasheet, PDF (1/104 Pages) STMicroelectronics – iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

LSM6DS3US
iNEMO inertial module:
always-on 3D accelerometer and 3D gyroscope
Datasheet - production data
LGA-14L
(2.5 x 3 x 0.83 mm) typ.
Features
 Power consumption: 0.85 mA in combo normal
mode and 1.1 mA in combo high-performance mode
up to 1.6 kHz.
 “Always-on” experience with low power
consumption for both accelerometer and gyroscope
 Interface flexibility: selectable SPI (3/4-wire) or I²C
with the main processor
 Auxiliary SPI (3-wire) to support OIS applications
 EIS/OIS support
 Accelerometer ODR up to 6.66 kHz
 Gyroscope ODR up to 3.33 kHz
 Smart FIFO
 ±2/±4/±8/±16 g full scale
 ±125/±245/±500/±1000/±2000 dps full scale
 Analog supply voltage: 1.71 V to 3.6 V
 Independent IOs supply (1.62 V)
 Compact footprint, 2.5 mm x 3 mm x 0.83 mm
 SPI/I²C serial interface data synchronization feature
 Embedded temperature sensor
 ECOPACK^®, RoHS and “Green” compliant
Applications
 EIS and OIS for camera applications
 Collecting sensor data
 Motion tracking and gesture detection
 Pedometer, step detector and step counter
 Significant motion and tilt functions
 Indoor navigation
 IoT and connected devices
 Vibration monitoring and compensation
Description
The LSM6DS3US is a system-in-package featuring a
3D digital accelerometer and a 3D digital gyroscope
performing at 1.1 mA (up to 1.6 kHz ODR) in high-
performance mode and enabling always-on low-power
features for an optimal motion experience for the
consumer.
The LSM6DS3US supports main OS requirements,
offering real, virtual and batch sensors with 4 kbyte
FIFO + flexible 4 kbyte (FIFO or programmable) for
dynamic data batching.
The LSM6DS3US gyroscope supports both OIS/EIS
applications. The device can be connected to the
camera module through a dedicated auxiliary SPI
(Mode 3) while flexibility for the primary interface is
available (I²C/SPI).
ST’s family of MEMS sensor modules leverages the
robust and mature manufacturing processes already
used for the production of micromachined
accelerometers and gyroscopes.
The various sensing elements are manufactured using
specialized micromachining processes, while the IC
interfaces are developed using CMOS technology that
allows the design of a dedicated circuit which is
trimmed to better match the characteristics of the
sensing element.
The LSM6DS3US has a full-scale acceleration range of
±2/±4/±8/±16 g and an angular rate range of
±125/±245/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the
LSM6DS3US the preferred choice of system designers
for the creation and manufacturing of reliable products.
The LSM6DS3US is available in a plastic land grid
array (LGA) package.
Table 1. Device summary
Part number
Temp.
range [°C]
Package
Packing
LGA-14L
LSM6DS3USTR -40 to +85 _{(2.5 x 3 x 0.83 mm)}
Tape &
Reel
April 2016
This is information on a product in full production.
DocID028476 Rev 4
1/104
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