GX4002 Datasheet, PDF (60/74 Pages) Gennum Corporation – Dynamic on-chip power management control

7.3 Packaging Data
Parameter
Value
Package Type
32-pin QFN / 5mm x 5mm
/ 0.5mm pad pitch
Moisture Sensitivity Level
3
Junction to Case Thermal Resistance, θ_j-c
17.8°C/W
Junction to Air Thermal Resistance (at zero airflow), θ_j-a
26.4°C/W
Psi = Junction-to-Top (of Package) Characterization Parameter, Ψ 0.4°C/W
Pb-free and RoHS compliant
Yes
7.4 Solder Reflow Profile
The device is manufactured with Matte-Sn terminations and is compatible with both
standard eutectic and Pb-free solder reflow profiles. MSL qualification was performed
using the maximum Pb-free reflow profile shown in Figure 7-1.
Temperature
260°C
250°C
217°C
200°C
60s to 150s
20s to 40s
3°C/s maximum
6°C/s maximum
150°C
25°C
60s to180s maximum
8m maximum
Figure 7-1: Maximum Pb-free Solder Reflow Profile
Time
GX4002 2x2 14.025Gb/s Crosspoint Switch with Trace
Equalization and Output De-Emphasis
Data Sheet
55972 - 0
March 2012
60 of 74
Proprietary & Confidential