K4R271669B Datasheet, PDF (20/20 Pages) Samsung semiconductor – 256K x 16/18 bit x 32s banks Direct RDRAMTM

K4R271669B/K4R441869B
Center-Bonded uBGA Package
(62 Balls)
Figure 4 shows the form and dimensions of the recom-
mended package for the center-bonded CSP device class
D
A BCD E F GH J
1
2
3
4
5
6
7
8
9
10
11
12
d e1
Bottom
A
e2
Bottom
Direct RDRAM^™
Bottom
Top
E1
Figure 4: Center-Bonded uBGA Package
E
Table 19 lists the numerical values corresponding to dimen-
sions shown in Figure 4.
Table 19: Center-Bonded uBGA Package Dimensions
Symbol
e1
e2
A
D
E
E1
d
Parameter
Ball pitch (x-axis)
Ball pitch (y-axis)
Package body length
Package body width
Package total thickness
Ball height
Ball diameter
Min(128Mb/144Mb) Max(128Mb/144Mb)
1.00
1.00
0.8
0.8
11.90
10.10
-
0.20
0.30
12.10
10.30
1.00^a
0.30
0.40
a. The E,MAX parameter for SO-RIMM applications is 0.94mm.
Unit
mm
mm
mm
mm
mm
mm
mm
Page 18
Version 1.11 Oct. 2000