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K4R271669B Datasheet, PDF (13/20 Pages) Samsung semiconductor – 256K x 16/18 bit x 32s banks Direct RDRAMTM | |||
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K4R271669B/K4R441869B
Direct RDRAMâ¢
Electrical Characteristics
Table 10: Electrical Characteristics
Symbol
ÎJC
IREF
IOH
IALL
âIOL
rOUT
IOL
II,CMOS
VOL,CMOS
VOH,CMOS
Parameter and Conditions
Junction-to-Case thermal resistance
VREF current @ VREF,MAX
RSL output high current @ (0â¤VOUTâ¤VDD)
RSL IOL current @ VOL = 0.9V, VDD,MIN , TJ,MAXa
RSL IOL current resolution step
Dynamic output impedance @ VOL= 0.9V
RSL IOL current @ VOL = 1.0V b,c
CMOS input leakage current @ (0â¤VI,CMOSâ¤VCMOS)
CMOS output voltage @ IOL,CMOS= 1.0mA
CMOS output high voltage @ IOH,CMOS= -0.25mA
Min
-
-10
-10
30.0
-
150
26.6
-10.0
-
VCMOS-0.3
Max
Unit
0.5
°C/Watt
10
µA
10
µA
90.0
mA
2.0
mA
-
â¦
30.6
mA
10.0
µA
0.3
V
-
V
a. This measurement is made in manual current control mode; i.e. with all output device legs sinking current.
b. This measurement is made in automatic current control mode after at least 64 current control calibration operations to a device and after CCA and
CCB are initialized to a value of 64. This value applies to all DQA and DQB pins.
c. This measurement is made in automatic current control mode in a 25⦠test system with VTERM= 1.714V and VREF= 1.357V and with the ASYMA
and ASYMB register fields set to 0.
Page 11
Version 1.11 Oct. 2000
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