TDA8029 Datasheet, PDF (51/58 Pages) NXP Semiconductors – Low power single card reader

Philips Semiconductors
Low power single card reader
Product specification
TDA8029
SYMBOL
PARAMETER
CONDITIONS
t_i(r), t_i(f)
t_o(r), t_o(f)
R_pu
t_edge
I_edge
input rise and fall times
output rise and fall times
internal pull-up resistance
between I/O and V_CC
width of active pull-up
pulse
current from I/O when
active pull-up
C_L ≤ 60 pF
C_L ≤ 60 pF
I/O configured as output,
rising from LOW to HIGH
V_OH = 0.9 V_CC; C = 60 pF
Timings
t_act
activation sequence
duration
t_de
deactivation sequence
duration
Protections and limitations
I_CC(sd)
shut-down and limitation
current at V_CC
I_I/O(lim)
limitation current on I/O
I_CLK(lim)
limitation current on CLK
I_RST(sd)
shut-down current on RST
I_RST(lim)
limitation current on RST
T_sd
shut-down temperature
Card presence input: pin PRES
V_IL
V_IH
I_LI(L)
I_LI(H)
LOW level input voltage
HIGH level input voltage
input leakage current LOW V_I = 0
input leakage current
HIGH
V_I = V_DD
Shut-down input: pin SDWN_N
V_IL
V_IH
I_LI(L)
I_LI(H)
LOW level input voltage
HIGH level input voltage
input leakage current LOW V_I = 0
input leakage current
HIGH
V_I = V_DD
General purpose I/O: pins P16, P17, P26, P27, INT1_N, RX and TX
V_IL
LOW level input voltage
V_IH
HIGH level input voltage
V_OL
output voltage LOW
I_OL = 1.6 mA
V_OH
output voltage HIGH
I_OH = −30 µA
I_IL
input current LOW
V_I = 0.4 V
I_THL
HIGH to LOW transition V_I = 2 V
current
MIN.
−
−
11
1_/2fXTAL1
−1
TYP.
−
−
14
MAX.
1
0.1
17
−
1_/3fXTAL1
−
−
−
−
130
−
−
100
−
−15
−70
−
−20
−
−
0.7V_DD
−20
−20
−100 −
−
+15
−
+70
−20 −
−
+20
150 −
−
0.3V_DD
−
−
−
+20
−
+20
−
0.7V_DD
−20
−20
−
0.3V_DD
−
−
−
+20
−
+20
−
−
0.2V_DD + 0.9 −
−
−
V_DD − 0.7
−
−1
−
−
−
0.2V_DD
−
0.4
−
−50
−650
UNIT
µs
µs
kΩ
ns
mA
µs
µs
mA
mA
mA
mA
mA
°C
V
V
µA
µA
V
V
µA
µA
V
V
V
V
µA
µA
2003 Oct 30
51