TDA8029 Datasheet, PDF (47/58 Pages) NXP Semiconductors – Low power single card reader

Philips Semiconductors
Low power single card reader
Product specification
TDA8029
9 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
V_DCIN
V_DD
V_n
P_tot
T_stg
T_j
V_esd
PARAMETER
CONDITIONS
input voltage for the DC/DC converter
supply voltage
voltage limit
on pins SAM, SBM, SAP, SBP and VUP
on all other pins
continuous total power dissipation
storage temperature
T_amb = −40 to +90 °C
junction temperature
electrostatic discharge voltage
on pins I/O, V_CC, RST, CLK and GNDC
on pin PRES
human body model;
note 1
on pins SAM and SBM
on other pins
MIN.
−0.5
−0.5
−0.5
−0.5
−
−55
−
−6
−3
−1
−2
Note
1. Human body model as defined in JEDEC Standard JESD22-A114-B, dated June 2000.
MAX.
+6.5
+6.5
UNIT
V
V
7.5
V
V_DD + 0.5 V
500
mW
+150
°C
125
°C
+6
kV
+3
kV
+1
kV
+2
kV
10 HANDLING
Inputs and outputs are protected against electrostatic discharge voltages during normal handling. However, to be totally
safe, it is desirable to take normal precautions appropriate to handling MOS devices.
11 THERMAL CHARACTERISTICS
SYMBOL
R_th(j-a)
PARAMETER
thermal resistance from junction to
ambient
CONDITIONS
in free air
VALUE
80
UNIT
K/W
2003 Oct 30
47