TDA8029 Datasheet, PDF (49/58 Pages) NXP Semiconductors – Low power single card reader

Philips Semiconductors
Low power single card reader
Product specification
TDA8029
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
DC/DC converter
f_int
V_VUP
V_det
oscillation frequency
voltage on pin VUP
detection voltage for
doubler/tripler selection
5 V card
3 V card
2
2.6 3.2
MHz
−
5.7 −
V
−
4.1 −
V
3.4
3.5 3.6
V
Reset output to the card: pin RST
V_O(inactive)
I_O(inactive)
output voltage in inactive
mode
current from RST when
inactive and pin grounded
no load
I_O(inactive) = 1 mA
0
−
0.1
V
0
−
0.3
V
0
−
−1
mA
V_OL
LOW level output voltage I_OL = 200 µA
V_OH
HIGH level output voltage I_OH = −200 µA
t_r
rise time
C_L = 250 pF
t_f
fall time
C_L = 250 pF
0
−
0.3
V
0.9V_CC
−
V_CC
V
−
−
0.1
µs
−
−
0.1
µs
Clock output to the card: pin CLK
V_O(inactive)
I_O(inactive)
V_OL
V_OH
t_r
t_f
f_clk
output voltage in inactive
mode
current from pin CLK
LOW level output voltage
HIGH level output voltage
rise time
fall time
clock frequency
no load
I_O(inactive) = 1 mA
inactive and pin grounded
I_OL = 200 µA
I_OH = −200 µA
C_L = 35 pF, V_CC = 5 or 3 V
C_L = 35 pF, V_CC = 5 or 3 V
1 MHz idle configuration
operational
0
0
0
0
0.9V_CC
−
−
1
0
−
0.1
−
0.3
−
−1
−
0.3
−
V_CC
−
10
−
10
−
1.5
−
20
V
V
mA
V
V
ns
ns
MHz
MHz
δ
SR_r, SR_f
duty cycle
slew rate, rise and fall
except for XTAL; C_L = 35 pF 45
C_L = 35 pF
0.2
−
55
−
−
%
V/ns
Card supply voltage: pin V_CC; 2 ceramic multilayer capacitances with low ESR of minimum 100 nF should be
used in order to meet these specifications
V_O(inactive) output voltage inactive
no load
0
I_O(inactive) = 1 mA
0
I_O(inactive) current from pin I/O
inactive and pin grounded
−
−
0.1
V
−
0.3
V
−
−1
mA
2003 Oct 30
49