E32DC200E Datasheet, PDF (18/56 Pages) Omron Electronics LLC – 530 Watts ECL Series

Features/Applications
Application-corresponding Models
Wafer Mapping
• Wafers are reliable detected with an ultrafine beam.
• The optical axis is adjusted before delivery to allow
easy installation.
E32-A03
■ Features
Optical axis adjusted
before delivery so
that displacement is
typically within 0.1°. ^{Direction of rotation}
E32-A03-1
■ Overview of Model Variations
Vertical rotation
■ Engineering Data
8-inch Wafer Mapping Characteristic (Typical Examples)
180
160
Wafer piles can
also be detected
140
120
100
80
170 mm
60
40
For
2 wafers
20
For
1 wafer
0
−10 −9 −8 −7 −6 −5 −4 −3 −2 −1 0
Distance moved, X (mm)
Fiber
6.35 mm
2-wafer pile
1 2 34
X Fiber
Silicon wafer
(t = 0.75 mm)
Type
Features
Shape, sensing distance (mm)*
Model number
Opening angle: 1.5°
With mounting
flange
E32-A03
890
E32-A03-1
Opening angle: 3° ultraslim
With mounting
flange
E32-A04
340
E32-A04-1
*The sensing distances apply for use in combination with the E3X-DA-S Amplifier Unit (general-purpose, standard mode).
Responding to the Increasing
Size of Installations
♦Impressive long-distance sensing capacity (up to 7 m)
♦MSR function for eliminating light not reflected from the reflector
♦Size-adjustable line and area beams
Glass detection through a view port
Long-distance and
E3C-LDA-series Photoelectric Sensors with Separate Digital Amplifiers (Laser Type)
High-precision Sensing and
Simple Installation
♦Parallel light kept at a constant diameter of 2 mm
for up to 1 m
♦Adjustment function for adjusting the optical axis
Wafer Ejection inspection
18