UPD98404 Datasheet, PDF (32/36 Pages) NEC – ADVANCED ATM SONET FRAMER

µPD98404
4. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document “Semiconductor Device
Mounting Technology Manual” (C10535E).
For soldering methods and conditions other than those recommended below, contact our sales personnel.
Surface Mount Type Soldering Conditions
• µPD98404GJ-KEU: 144-pin plastic QFP (fine pitch) (20 × 20 mm)
Soldering method
Soldering conditions
Infrared reflow
Partial heating
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: two times or less
Exposure limit: 3 days^Note (after that, prebake at 125°C for 20 hours)
Pin temperature: 300°C max., Duration: 3 seconds max. (per device side)
Recommended
soldering code
IR35-203-2
–
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
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Data Sheet S11822EJ4V0DS00