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MT40A512M16JY-083E Datasheet, PDF (342/358 Pages) Micron Technology – Automotive DDR4 SDRAM
Table 157: Electrical Characteristics and AC Timing Parameters (Continued)
Parameter
Minimum CKE low pulse width for self re-
fresh entry to self refresh exit timing
Minimum CKE low pulse width for self re-
fresh entry to self refresh exit timing
when CA parity is enabled
Valid clocks after self refresh entry (SRE)
or power-down entry (PDE)
Valid clock requirement after self refresh
entry or power-down when CA parity is
enabled
Valid clocks before self refresh exit (SRX)
or power-down exit (PDX), or reset exit
Exit power-down with DLL on to any val-
id command
Exit power-down with DLL on to any val-
id command when CA Parity is enabled.
CKE MIN pulse width
Command pass disable delay
Power-down entry to power-down exit
timing
Begin power-down period prior to CKE
registered HIGH
Power-down entry period: ODT either
synchronous or asynchronous
Power-down exit period: ODT either syn-
chronous or asynchronous
ACTIVATE command to power-down en-
try
PRECHARGE/PRECHARGE ALL command
to power-down entry
REFRESH command to power-down entry
MRS command to power-down entry
Symbol
tCKESR
tCKESR_PAR
DDR4-1600
Min Max
DDR4-1866
DDR4-2133
Min Max Min Max
MIN = tCKE (MIN) + 1nCK
DDR4-2400
Min Max
MIN = tCKE (MIN) + 1nCK + PL
tCKSRE
tCKSRE_PAR
MIN = greater of (5CK, 10ns)
MIN = greater of (5CK, 10ns) + PL
tCKSRX
MIN = greater of (5CK, 10ns)
Power-Down Timing
tXP
MIN = greater of 4CK or 6ns
tXP _PAR
MIN = (greater of 4CK or 6ns) + PL
tCKE (MIN)
MIN = greater of 3CK or 5ns
tCPDED
4
–
4
–
4
–
4
–
tPD
MIN = tCKE (MIN); MAX = 9 × tREFI
tANPD
WL - 1CK
PDE
Greater of tANPD or tRFC - REFRESH command to CKE LOW time
PDX
tANPD + tXSDLL
Power-Down Entry Minimum Timing
tACTPDEN
1
–
1
–
2
–
2
–
tPRPDEN
1
–
1
–
2
–
2
–
tREFPDEN
1
–
1
–
2
–
2
–
tMRSPDEN
MIN = tMOD (MIN)
Unit
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
CK
Notes
1
1
1
1
1
1
1
1
1