MT40A512M16JY-083E Datasheet, PDF (27/358 Pages) Micron Technology – Automotive DDR4 SDRAM

Figure 7: 96-Ball FBGA – x16 (JY)
0.155
1.8 CTR
Nonconductive
overmold
8Gb: x8, x16 Automotive DDR4 SDRAM
Package Dimensions
Seating plane
A
0.12 A
96X Ø0.47
Dimensions apply
to solder balls post-
reflow on Ø0.42 SMD
ball pads.
987
14 ±0.1
12 CTR
0.8 TYP
321
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Ball A1 ID
(covered by SR)
0.8 TYP
1.1 ±0.1
6.4 CTR
0.34 ±0.05
8 ±0.1
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: SAC302 (96.8% Sn, 3% Ag, 0.2% Cu).
Ball A1 ID
CCMTD-1406124318-10419
8gb_auto_ddr4_dram.pdf - Rev. C 3/17 EN
27
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