PIC24F16KA102_11 Datasheet, PDF (217/278 Pages) Microchip Technology – 20/28-Pin General Purpose, 16-Bit Flash Microcontrollers with nanoWatt XLP Technology

PIC24F16KA102 FAMILY
TABLE 29-1: THERMAL OPERATING CONDITIONS
Rating
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD –  IOH)
I/O Pin Power Dissipation:
PI/O =  ({VDD – VOH} x IOH) +  (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min
TJ
-40
TA
-40
Typ Max Unit
—
+175
°C
—
+125
°C
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/JA
W
TABLE 29-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 20-Pin PDIP
JA
62.4
—
°C/W
1
Package Thermal Resistance, 28-Pin SPDIP
JA
60
—
°C/W
1
Package Thermal Resistance, 20-Pin SSOP
JA
108
—
°C/W
1
Package Thermal Resistance, 28-Pin SSOP
JA
71
—
°C/W
1
Package Thermal Resistance, 20-Pin SOIC
JA
75
—
°C/W
1
Package Thermal Resistance, 28-Pin SOIC
JA
80.2
—
°C/W
1
Package Thermal Resistance, 20-Pin QFN
JA
43
—
°C/W
1
Package Thermal Resistance, 28-Pin QFN
JA
32
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-JA (JA) numbers are achieved by package simulations.
 2008-2011 Microchip Technology Inc.
DS39927C-page 217