PIC16LF876A-I Datasheet, PDF (217/234 Pages) Microchip Technology – 28/40/44-Pin Enhanced Flash Microcontrollers

PIC16F87XA
28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
B
2
n
1

A
c
A2

A1

L
Units
Dimension Limits
Number of Pins
n
Pitch
p
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
Lead Thickness
c
Foot Angle

Lead Width
B
Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter
§ Significant Characteristic
MIN
.068
.064
.002
.299
.201
.396
.022
.004
0
.010
0
0
INCHES
NOM
28
.026
.073
.068
.006
.309
.207
.402
.030
.007
4
.013
5
5
MAX
.078
.072
.010
.319
.212
.407
.037
.010
8
.015
10
10
MILLIMETERS*
MIN
NOM
28
0.65
1.73
1.85
1.63
1.73
0.05
0.15
7.59
7.85
5.11
5.25
10.06
10.20
0.56
0.75
0.10
0.18
0.00
101.60
0.25
0.32
0
5
0
5
MAX
1.98
1.83
0.25
8.10
5.38
10.34
0.94
0.25
203.20
0.38
10
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-150
Drawing No. C04-073
 2001-2013 Microchip Technology Inc.
DS39582C-page 217