5-103169-3 Datasheet, PDF (57/96 Pages) Tyco Electronics – AMPMODU Headers and Receptacles, .100 [2.54] Centerline

AMPMODU Interconnection System
AMPMODU Stacking Connectors—Shrouded,
.025 x .025 [0.64 x 0.64] Posts
Product Facts
■ Parallel PC board stacking
without use of mother boards
■ Provides space between
boards for interference-free
routing of wire-to-board
connections
■ Two header heights
available: .785 [19.94] and
1.200 [30.48]
■ Vertical mount headers are
fully shrouded
■ Receptacle contacts have
dual cantilever beams with
built-in overstress protection
■ .025 [0.64] sq. posts and
receptacle contacts on
double-row, .100 x .100
[2.54 x 2.54] centers
■ Header posts and receptacle
contacts are phosphor
bronze, duplex plated
■ Housings are made of
flame retardant, glass-filled
thermoplastic
AMPMODU stacking
connectors are a two-piece
interconnection system
designed for parallel
stacking printed circuit
boards, without the use of
mother boards.
Vertical mount headers and
receptacle assemblies
feature duplex plated posts
and receptacle contacts on
a double-row, .100 x .100
[2.54 x 2.54] grid. The .025
[ 0.64] sq. header posts are
more protected, and the
top-entry receptacle
contacts utilize the proven
AMPMODU receptacle
contact design; dual
cantilever beams with built-
in overstress protection.
Headers are available in
two heights: .785 [19.94]
and 1.200 [30.48]. This
allows the customer to
use the height of the header
to keep wire-to-board
connections up and
away from other board
components, particularly if
the components are densely
packaged around the
header.
5
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
141
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208