LTC3577-4_15 Datasheet, PDF (50/52 Pages) Linear Technology – Highly Integrated Portable Product PMIC

LTC3577-3/LTC3577-4
PACKAGE DESCRIPTION
UFF Package
Variation: UFFMA
44-Lead Plastic QFN (4mm × 7mm)
(Reference LTC DWG # 05-08-1762 Rev Ø)
1.48 ±0.05
4.50 ±0.05
3.10 ±0.05
2.40 REF
2.56 ±0.05
2.64 ±0.05
1.70 ±0.05
2.02 ±0.05
2.76 ±0.05
0.70 ±0.05
0.98 ±0.05
4.00 p0.10
PIN 1
TOP MARK
(SEE NOTE 6)
PACKAGE
OUTLINE
0.20 ±0.05
5.60 REF
6.10 ±0.05
7.50 ±0.05
0.40 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.75 p0.05
0.00 – 0.05
2.40 REF
43 44
2.64
±0.10
2.56
±0.10
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 s 45o
CHAMFER
0.40 p0.10
1
2
7.00 p0.10
0.200 REF
5.60 REF
1.70
R = 0.10
±0.10 _2.76 ^TYP
±0.10
0.74 ±0.10
R = 0.10 TYP
0.74 ±0.10
R = 0.10 TYP
0.98 ±0.10
(UFF44MA) QFN REF Ø 1107
0.20 p0.05
0.40 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
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