300 Datasheet, PDF (95/95 Pages) DB Lectro Inc – SCREW TYPE SERIES

Debug Tools Specifications
8 Debug Tools Specifications
8.1
8.1.1
8.1.2
Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interfaces
(LAIs) for use in debugging Celeron D processor systems. Tektronix and Agilent should
be contacted to get specific information about their logic analyzer interfaces. The
following information is general in nature. Specific information must be obtained from
the logic analyzer vendor.
Due to the complexity of Celeron D processor systems, the LAI is critical in providing
the ability to probe and capture FSB signals. There are two sets of considerations to
keep in mind when designing a Celeron D processor system that can make use of an
LAI: mechanical and electrical.
Mechanical Considerations
The LAI is installed between the processor socket and the Celeron D processor. The LAI
lands plug into the processor socket, while the Celeron D processor lands plug into a
socket on the LAI. Cabling that is part of the LAI egresses the system to allow an
electrical connection between the Celeron D processor and a logic analyzer. The
maximum volume occupied by the LAI, known as the keepout volume, as well as the
cable egress restrictions, should be obtained from the logic analyzer vendor. System
designers must make sure that the keepout volume remains unobstructed inside the
system. Note that it is possible that the keepout volume reserved for the LAI may differ
from the space normally occupied by the Celeron D processor heatsink. If this is the
case, the logic analyzer vendor will provide a cooling solution as part of the LAI.
Electrical Considerations
The LAI will also affect the electrical performance of the FSB; therefore, it is critical to
obtain electrical load models from each of the logic analyzers to be able to run system
level simulations to prove that their tool will work in the system. Contact the logic
analyzer vendor for electrical specifications and load models for the LAI solution it
provides.
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Datasheet
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