300 Datasheet, PDF (33/95 Pages) DB Lectro Inc – SCREW TYPE SERIES

Package Mechanical Specifications
3 Package Mechanical
Specifications
Figure 4.
The Celeron D processor is packaged in a Flip-Chip Land Grid Array (FC-LGA4) package
that interfaces with the motherboard via an LGA775 socket. The package consists of a
processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 4 shows a sketch of
the processor package components and how they are assembled together. Refer to the
LGA775 Socket Mechanical Design Guide for complete details on the LGA775 socket.
The package components shown in Figure 4 include the following:
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
Processor Package Assembly Sketch
Core (die)
TIM
IHS
Substrate
3.1
System Board
Capacitors
LGA775 Socket
NOTE:
1.
Socket and motherboard are included for reference and are not part of processor package.
Package Mechanical Drawing
The package mechanical drawings are shown in Figure 5 and Figure 6. The drawings
include dimensions necessary to design a thermal solution for the processor. These
dimensions include:
• Package reference with tolerances (total height, length, width, etc.)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keep-out dimensions
• Reference datums
• All drawing dimensions are in mm [in].
• Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the processor Thermal and
Mechanical Design Guidelines.
Datasheet
33