300 Datasheet, PDF (76/95 Pages) DB Lectro Inc – SCREW TYPE SERIES

Thermal Specifications and Design Considerations
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 26 instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor
Feature must be enabled for the processor to remain within specification.
Table 26. Processor Thermal Specifications for 775_VR_CONFIG_05A Processors
Processor
Number
Core Frequency
(GHz)
Thermal
Design
Power (W)
Minimum
T_C (°C)
Maximum T_C (°C)
Notes
356
3.33
352
3.2
347
3.06
86
5
1, 2
86
5
See Table 28 and
1, 2
Figure 12
86
5
1, 2
NOTES:
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the
maximum power that the processor can dissipate.
2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP.
Therefore, the maximum T_C will vary depending on the TDP of the individual processor. Refer to thermal profile
figure and associated table for the allowed combinations of power and T_C.
Table 27. Processor Thermal Specifications for 775_VR_CONFIG_06 Processors
Processor
Number
Core Frequency
(GHz)
Thermal
Design
Power (W)
Minimum
T_C (°C)
Maximum T_C (°C)
Notes
365
3.66
360
3.46
356
3.33
352
3.2
347
3.06
65
5
1, 2
65
5
1, 2
65
5
See Table 29 and
1, 2
Figure 13
65
5
1, 2
65
5
1, 2
NOTES:
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power
that the processor can dissipate.
2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the max-
imum T_C will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for the
allowed combinations of power and T_C.
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Datasheet