300 Datasheet, PDF (3/95 Pages) DB Lectro Inc – SCREW TYPE SERIES

Contents
1 Introduction................................................................................................................. 9
1.1 Terminology ....................................................................................................... 9
1.1.1 Processor Packaging Terminology ............................................................. 10
1.2 References ....................................................................................................... 11
2 Electrical Specifications ............................................................................................... 13
2.1 Power and Ground Lands.................................................................................... 13
2.2 Decoupling Guidelines ........................................................................................ 13
2.2.1 VCC Decoupling ..................................................................................... 13
2.2.2 VTT Decoupling ...................................................................................... 14
2.2.3 FSB Decoupling...................................................................................... 14
2.3 Voltage Identification ......................................................................................... 14
2.4 Reserved, Unused, and TESTHI Signals ................................................................ 16
2.5 Voltage and Current Specification ........................................................................ 17
2.5.1 Absolute Maximum and Minimum Ratings .................................................. 17
2.5.2 DC Voltage and Current Specification ........................................................ 18
2.5.3 VCC Overshoot ...................................................................................... 21
2.5.4 Die Voltage Validation ............................................................................. 22
2.6 Signaling Specifications...................................................................................... 22
2.6.1 FSB Signal Groups.................................................................................. 23
2.6.2 GTL+ Asynchronous Signals..................................................................... 25
2.6.3 Processor DC Specifications ..................................................................... 25
2.6.3.1 GTL+ Front Side Bus Specifications ............................................. 28
2.7 Clock Specifications ........................................................................................... 29
2.7.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 29
2.7.2 FSB Frequency Select Signals (BSEL[2:0])................................................. 30
2.7.3 Phase Lock Loop (PLL) and Filter .............................................................. 30
2.7.4 BCLK[1:0] Specifications ......................................................................... 32
3 Package Mechanical Specifications ................................................................................ 33
3.1 Package Mechanical Drawing............................................................................... 33
3.2 Processor Component Keep-Out Zones ................................................................. 37
3.3 Package Loading Specifications ........................................................................... 37
3.4 Package Handling Guidelines............................................................................... 37
3.5 Package Insertion Specifications.......................................................................... 38
3.6 Processor Mass Specification ............................................................................... 38
3.7 Processor Materials............................................................................................ 38
3.8 Processor Markings............................................................................................ 38
3.9 Processor Land Coordinates ................................................................................ 39
4 Land Listing and Signal Descriptions ............................................................................. 41
4.1 Processor Land Assignments ............................................................................... 41
4.2 Alphabetical Signals Reference ............................................................................ 64
5 Thermal Specifications and Design Considerations........................................................... 75
5.1 Processor Thermal Specifications ......................................................................... 75
5.1.1 Thermal Specifications ............................................................................ 75
5.1.2 Thermal Metrology ................................................................................. 79
5.2 Processor Thermal Features ................................................................................ 79
5.2.1 Thermal Monitor..................................................................................... 79
5.2.2 On-Demand Mode .................................................................................. 80
5.2.3 PROCHOT# Signal .................................................................................. 81
5.2.4 THERMTRIP# Signal ............................................................................... 81
Datasheet
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