3XX Datasheet, PDF (4/82 Pages) Intel Corporation – Celeron D Processor

5.2.3
5.2.4
5.2.5
5.2.6
PROCHOT# Signal Pin .......................................................................... 66
THERMTRIP# Signal Pin ....................................................................... 66
T_CONTROL and Fan Speed Reduction (Optional) ................................... 67
Thermal Diode........................................................................................ 67
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Features ....................................................................................................................... 69
6.1 Power-On Configuration Options ........................................................................ 69
6.2 Clock Control and Low Power States.................................................................. 69
6.2.1 Normal State—State 1 ........................................................................... 69
6.2.2 AutoHALT Powerdown State—State 2 .................................................. 70
6.2.3 Stop-Grant State—State 3 ..................................................................... 71
6.2.4 HALT/Grant Snoop State—State 4 ........................................................ 71
6.2.5 Sleep State—State 5.............................................................................. 72
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Boxed Processor Specifications ....................................................................... 73
7.1 Mechanical Specifications................................................................................... 74
7.1.1 Boxed Processor Cooling Solution Dimensions ..................................... 74
7.1.2 Boxed Processor Fan Heatsink Weight.................................................. 75
7.1.3 Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly ............................................................................. 75
7.2 Electrical Requirements ...................................................................................... 76
7.2.1 Fan Heatsink Power Supply ................................................................... 76
7.3 Thermal Specifications........................................................................................ 77
7.3.1 Boxed Processor Cooling Requirements ............................................... 77
7.3.2 Variable Speed Fan ............................................................................... 79
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Debug Tools Specifications................................................................................. 81
8.1 Logic Analyzer Interface (LAI)............................................................................. 81
8.1.1 Mechanical Considerations .................................................................... 81
8.1.2 Electrical Considerations........................................................................ 81
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Datasheet