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| 80C186EA Datasheet, PDF (20/50 Pages) Intel Corporation – 16-BIT HIGH-INTEGRATION EMBEDDED PROCESSORS | |||
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80C186EA 80C188EA 80L186EA 80L188EA
Figure 7 Shrink Quad Flat Pack (SQFP) Pinout Diagram
272432 â 7
NOTES
1 XXXXXXXXD indicates the Intel FPO number
2 Pin names in parentheses apply to the 80C188EA
PACKAGE THERMAL
SPECIFICATIONS
The 80C186EA 80L186EA is specified for operation
when TC (the case temperature) is within the range
of 0 C to 85 C (PLCC package) or 0 C to 106 C
(QFP-EIAJ) package TC may be measured in any
environment to determine whether the processor is
within the specified operating range The case tem-
perature must be measured at the center of the top
surface
TA (the ambient temperature) can be calculated
from iCA (thermal resistance from the case to ambi-
ent) with the following equation
TA e TC - P c iCA
Typical values for iCA at various airflows are given
in Table 10
P (the maximum power consumption specified in
watts) is calculated by using the maximum ICC as
tabulated in the DC specifications and VCC of 5 5V
Table 10 Thermal Resistance (iCA) at Various Airflows (in C Watt)
Airflow Linear ft min (m sec)
0 200 400 600 800 1000
(0) (1 01) (2 03) (3 04) (4 06) (5 07)
iCA (PLCC)
iCA (QFP)
iCA (SQFP)
29 25 21 19
66 63 60 5 59
70
17 16 5
58 57
20
20
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