80960CF-30 Datasheet, PDF (20/62 Pages) Intel Corporation – SPECIAL ENVIRONMENT 80960CF-30, -25, -16 32-BIT HIGH-PERFORMANCE SUPERSCALAR PROCESSOR

SPECIAL ENVIRONMENT 80960CF-30 -25 -16
3 5 Package Thermal Specifications
The 80960CF is specified for operation when T_C
(the case temperature) is within the range of
b_{40 C –} a_{110 C TC may be measured in any envi-}
ronment to determine whether the 80960CF is within
specified operating range The case temperature is
measured at the center of the top surface opposite
the pins Refer to Figure 7
T_A (the ambient temperature) can be calculated
from i_CA (thermal resistance from case to ambient)
with the following equation
T_A e T_C b P i_CA
Table 8 shows the maximum T_A allowable (without
exceeding T_C) at various airflows and operating fre-
quencies (f_PCLK)
Note that T_A is greatly improved by attaching fins or
a heat sink to the package P (the maximum power
consumption) is calculated by using the typical I_CC
as tabulated in Section 4 4 DC Specifications and
V_CC of 5V
Table 8 Maximum T_A at Various Airflows In C (PGA Package Only)
Airflow-ft min (m sec)
f_PCLK
0
200
400
600
800
(MHz)
(0)
(1 01)
(2 03)
(3 04)
(4 06)
T_A
33
38
57
74
76
81
with
25
50
65
79
81
85
Heat Sink
16
63
74
84
86
89
T_A
without
33
18
33
47
57
66
25
34
46
57
65
72
Heat Sink
16
51
60
68
74
80
0 285 high unidirectional heat sink (Al alloy 6061 50 mil fin width 150 mil center-to-center fin spacing)
1000
(5 07)
84
87
90
67
74
81
PGA Thermal Resistance C Watt
Airflow ft min (m sec)
Parameter
0 200 400 600 800 1000
(0) (1 01) (2 03) (3 07) (4 06) (5 07)
i Junction-to-Case
(Case Measured
15 15 15 15 15 15
as shown in Figure 7)
i Case-to-Ambient
(No Heatsink)
17 14
11
9
71 66
i Case-to-Ambient
(with Unidirectional) 13 9
Heatsink)
55 50 39 34
NOTES
1 This table applies to 80960CF PGA plugged into socket or soldered directly
into board
2 i_JA e i_JC a i_CA
3 i_J-CAP e 4 C W (approx )
i_J-PIN e 4 C W (inner pins) (approx )
i_J-PIN e 8 C W (outer pins) (approx )
0 285 high unidirectional heat sink (Al alloy 6061 50 mil fin width 150 mil
center-to-center fin spacing)
Figure 6 80960CF PGA Package Thermal Characteristics
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