80960CF-30 Datasheet, PDF (19/62 Pages) Intel Corporation – SPECIAL ENVIRONMENT 80960CF-30, -25, -16 32-BIT HIGH-PERFORMANCE SUPERSCALAR PROCESSOR

SPECIAL ENVIRONMENT 80960CF-30 -25 -16
Table 7 Ceramic PGA Package Dimension Symbols
Letter or
Symbol
A
A₁
A₂
A₃
B
D
D₁
e₁
L
S₁
Description of Dimensions
Distance from seating plane to highest point of body
Distance between seating plane and base plane (lid)
Distance from base plane to highest point of body
Distance from seating plane to bottom of body
Diameter of terminal lead pin
Largest overall package dimension of length
A body length dimension outer lead center to outer lead center
Linear spacing between true lead position centerlines
Distance from seating plane to end of lead
Other body dimension outer lead center to edge of body
NOTES
1 Controlling dimension millimeter
2 Dimension ‘‘e₁’’ (‘‘e’’) is non-cumulative
3 Seating plane (standoff) is defined by P C board hole size 0 0415 – 0 0430 inch
4 Dimensions ‘‘B’’ ‘‘B₁’’ and ‘‘C’’ are nominal
5 Details of Pin 1 identifier are optional
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