BTC50010-1TAA_15 Datasheet, PDF (13/31 Pages) Infineon Technologies AG – High-Side Power Connector

BTC50010-1TAA
4.3
Thermal Resistance
General Product Characteristics
Table 4 Thermal Resistance¹⁾ at T_J = 25 °C
Parameter
Symbol
Min.
Values
Unit Note /
Typ. Max.
Test Condition
Number
Junction to Case
R_thJC
–
–
Junction to Ambient
R_thJA(2S2P)
–
20
Junction to Ambient
R_thJA(1S0p)
–
70
1) Not subject to production test, specified by design.
0.5
K/W ²⁾
–
K/W ^{2) 3)}
–
K/W ^{2) 4)}
P_4.3.1
P_4.3.2
P_4.3.3
2) Device is dissipating 1W power.
3) Specified R_thJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The product (chip +
package) was simulated on a 76,4 x 114,3 x 1,5 mm board with 2 inner copper layers (2 x 70 µm Cu, 2 x 35 µm Cu). Where
applicable, a thermal via array under the exposed pad contacted the first inner copper layer.
4) Specified R_thJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 1s0p board; The product (chip +
package) was simulated on a 76,4 x 114,3 x 1,5 mm board with 1 copper layer (1 x 70 µm Cu).
Figure 6 is showing the typical thermal impedance of BTC50010-1TAA mounted on different PCB setup on FR4
1s0p (single layer) and 2s2p (quad layer) boards at T_J of 25°C and 105°C according to Jedec JESD51-2,-5,-7 at
natural convection.
100
2s2p Tj=105°C
2s2p Tj=25°C
10
1s0p Tj=105°C
1s0p Tj=25°C
1
0.1
0.01
Figure 6
0.001
1E-06 1E-05 0.0001 0.001 0.01 0.1
1
10 100 1000 10000
Time [s]
Typical Transient Thermal Impedance Z_th(JA) = f(t) for Different Cooling Areas
Data Sheet
Connect FET
13
1.3, 2015-02-06