BTC50010-1TAA_15 Datasheet, PDF (10/31 Pages) Infineon Technologies AG – High-Side Power Connector

BTC50010-1TAA
General Product Characteristics
BTC50010-1TAA current robustness:
Below diagram present the current robustness of BTC50010-1TAA. Generally, module thermal characteristic is
more depending on the module construction (e.g. PCB size, metal layer thickness and numbers, module
connectors) than the thermal characteristic of BTC50010-1TAA alone. When current pulse is longer than 0.3s,
influence of module thermal characteristic is dominant. When current pulse is shorter than 0.3s, influence of
thermal characteristic of BTC50010-1TAA is getting significant.
Combining BTC50010-1TAA together with a fuse in application, the total I/t curve of the module (incl. BTC50010-
1TAA) has to be above the fuse I/t curve. With specified test setup ¹⁾ BTC50010-1TAA can withstand minimum 10
fuse blows of a 30A ATO FUSE.
BTC50010-1TAA current robustness
at T_A=125°C and T_A=25°C, Vs=13.5V
PCB is vertical, keep constant enviroment temperature by airflow
1000
100
Device absolute max. ratings
@TA=125°C
Device absolute max. ratings
10
@TA=25°C
1
0,1
0,01
10
100
Current [A]
1000
Figure 4 BTC50010-1TAA Current Robustness at T_A = 25°C and T_A = 125°C; V_S = 13.5V ¹⁾
Notes
1. Stresses above the ones described in Chapter 4.1 may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
1) Use test PCB with 2 x 70 µm Cu layers and size of 54 x 48 x 1.5 mm. Where applicable, thermal via array is placed under
the device footprint on this PCB. BTC50010-1TAA on PCB has RthJA(2P) = 19.6 K/W (referring to with 1 W power
dissipation). PCB is vertical, keep constant environment temperature by indirect airflow of 6l/s.
Data Sheet
Connect FET
10
1.3, 2015-02-06